Full RF and Digital Design for Radar

Slipstream Engineering Design Ltd is an engineering consultancy experience in RF and digital design for radar applications from top level system definition right down to the sub-module design. Working across many frequencies and powers, Slipstream Design’s expertise in solid-state radar development covers electronically scanning phased-array radar, analogue and digital-beamforming radar and radar purposed for extreme environments.

Our experience has drawn customers working across the radar domain from Tier 1 Defence OEMs to ambitious start-ups looking to transform markets. This spectrum of activity across industrial and military applications allows us a unique visibility of current state-of-the-art technologies.

We have direct experience in developing modules for: digital signal generation, transmit/receive and power amplification as well as antenna development and digital signal processing algorithms. Couple with our mechanical capability we drive power dense, thermally optimised, simply manufactured products that do not require manual tuning during manufacture.

Radar Design Case Study

Slipstream Engineering Design Ltd. was contracted by a Tier 1 commercial radar manufacturer to develop their next generation of electronic phased-array radar.

In order to understand our clients exact requirements, we developed a close and collaborative relationship to develop a series of specifications for sub-modules including Transmit / Receive modules (TRM), High Power Amplifiers (HPA) and Up/Down Converters (UDC). Open and honest communications have allowed for a transparent design and development process which is now transitioning into New Product Introduction (NPI) and volume manufacturing phases.

By closely co-ordinating the system design with the client we have delivered the following products to very aggressive Size, Weight and Performance and Cost (SWaP-C) requirements;

• HPA & LNA: 100W X Band Power amplifier and LNA including comprehensive digital control and monitoring in an extremely compact design. Utilising simple manufacturing methods without requirements for manual tuning or adjustment. The module has also been engineered for simple manufacturing processes (SMT, no bond wires, simple board structure, etc). Full thermal architecture designed to accommodate exceptionally thermal high-power densities
• UDC: Digital Interface to X-Band up-down-converter which encompassed an FPGA for digital control and signal processing
• Transmit Receiver Conditioner: To provide additional functionality, signal conditioning and to serve as a gain block between client hardware and low-cost off-the-shelf third-party hardware
• Phased array TRMs: X-band multi-channel phased array power amplifier and receivers with integrated digital phase and amplitude control. Designed for high-volume, low cost, productionised design, full thermal engineering to ensure high MTBF, novel thermal architecture and a simple plug-and-play mechanical interface
• ATE: Advanced and fully automated productionised Automated Test Environment using industry standard software tools and high-end test equipment to ensure that all products shipped were manufactured to a high standard with RF performance parameters captured.

Radar Design Testimonial

‘Slipstream Design achieved a perfect record of deliveries on time, cost and performance. They demonstrated highly cooperative and responsive working and they impressed with their competence as a team. They brought several important innovations to the design and contributed as partners to the overall endeavour.’

Professor John Roulston

Applications

• Electronically scanned phase array radar
• Ground penetrating radar
• Radar for extreme environments
• Perimeter monitoring
• Drone detection radar
• Marine radar
• Airborne radar
• Ground penetrating radar

About Slipstream Engineering Design

At Slipstream Engineering Design we support the innovators, the pioneers and the futurists. We design and build your RF products to transform performance and disrupt your markets.

By developing deeply collaborative partnerships through unwavering curiosity, we solve your complex RF and Digital challenges to produce highly original products that maintain your strategic advantage. Our multidisciplinary engineering team develops bespoke RF and Digital modules for seamless system integration.